Laser machine LTF
The LTF system is the most compact model of the Cutlite Penta production range for diemaking, since it represents the right solution for diemakers and in-house dieshops. The cutting area available are mostly two, 1750x1350mm and 2200x1550mm, two sizes suitable for every kind of folding carton die.
The system motion is given by a movable bridge, on which the laser source is installed, which runs along the X-axis, and a cutting head running along the Y-axis. The LTF system can be equipped with El.En. manufactured radiofrequency sources, with powers ranging from 750W to 850W besides the cutting head of the LTF system, it is possible to install a marking head that allows marking codes and/or logos on the die-board. Thanks to its combination of cutting head and marking head, the LTF system can guarantee short times to carry out finished dieboards.
Dieboard cutting with LTF
- Small and compact: Its footprint is slightly larger than its working area
- Full of technology: Digital CNC, drivers
- All in one: electrical unit, laser source, integrated control panel
- Easy and fast installation: in one day the machine is ready to start production
- Software: in-house designed and integrated on-board
|Laser Power (Watt)||(RF777) 750 – (RF888) 850|
|Working area||1713 (1750 x 1250 mm) 2015 (2200 x 1550 mm)|
|Z axes||80 mm|
software solutions for LTF
hardware solutions for LTF
Camera Vision system (CCD camera)
CP Scan (Galvo head)
CP Steel (Capacitive head)
Find out other types of laser cutting we can offer:
Sturdy, reliable and fast machines: laser cutting machines for plastic materials are at your side in the most difficult production cycles.
Due to engineered optics and the most sought-after laser sources, our machines allow to obtain clean, precise and regular cuts.
Flexibility and precision are the keywords underlying the design of Cutlite Penta’s five-axis cutting systems.
Take advantage of Cutlite Penta’s best technology. We supply OEM solutions that can be integrated in existing or new industrial systems.